Product Introduction:

The automatic flexible chip taping machine separates loose ICs into front and back sides using a flexible vibrating plate and a vision camera. Then, a suction nozzle picks up the separated ICs and places them at the camera position for orientation and mixing identification. Defective ICs are discarded in a defective box, while OK ICs are placed sequentially into the taping system and re-identified by a rear-end orientation recognition camera. After identification, the encapsulation film is pressed onto the ICs, completing the taping and packaging process.

Product Features:

1. High Efficiency: Maximum capacity 6K/H
2. Precision: Precise vision gripping, defective products discarded
3. Compatibility: Suitable for chips, metal parts, plastic parts, TF cards, irregularly shaped parts, etc., with dimensions of 2~30mm
4. Operation: Quick product switching, easy to learn.

Product Introduction:

The automatic flexible taping machine separates loose ICs into front and back sides using a flexible vibrating plate and a vision camera. Then, a suction nozzle picks up the separated ICs and places them at the camera position for orientation and to identify whether they are mixed. Defective ICs are discarded in a defective box, while OK ICs are placed sequentially into standard trays. After tray loading, the machine automatically stacks and loads trays for the next batch.

Product Features:

1. High Efficiency: Maximum capacity 6K/H
2. Precision: Precise vision-based picking, defective ICs discarded
3. Compatibility: Suitable for chips, hardware, plastic parts, TF cards, and irregularly shaped parts with dimensions of 2~30mm
4. Operation: Quick product switching, easy to learn, automatic tray loading and unloading

Product Introduction:

The fully automatic chip inspection machine is a device that automatically picks up a tray of ICs to be inspected from a hopper by placing the tray on the material level. The machine then automatically picks up the ICs to be inspected and transports them to the inspection station. It sequentially checks the solder balls for OK status. When an NG (non-compliant) chip is detected, a suction nozzle removes the defective chip and places it in a replenishment tray. Simultaneously, an OK chip is picked up from the replenishment tray and added to the inspection tray. This process achieves automatic inspection and replenishment. Finally, the tray containing all OK inspected chips is automatically placed into the stacking hopper. The entire process is completed automatically, greatly improving production efficiency.

Product Features: 1. High Efficiency: Maximum capacity 8K/H 2. Precision: Accurate visual identification of defects, appearance, ball size, missing balls, missing pads, solder bridging, misaligned solder balls, etc. 3. Compatibility: Trays of the same size can be shared; chip sizes can be shared. 4. Operation: Simple operation; quick model switching.

Product Introduction:

The keyboard assembly production line first locks the internal pressure strip of the product, assembles the components, presses them together, and then places the product into the fixture. Next, the product reaches the designated position. The first step is to tighten the screws, which is done at two stations. The second step is to take pictures of the product and the feet using a vision camera for precise foot placement. The third step is to take pictures of the product and the label using a vision camera for precise label placement. Finally, the product is removed and placed on the keyboard function testing machine for testing. After testing, it is automatically unloaded and returned to the assembly line.

Product Features:

1. Production Capacity: 260 pieces/hour
2. Precision: Vision-based precise gripping and bonding, accuracy 0.2mm
3. Advantages: Reduces manual operation and improves product quality