The automatic flexible chip taping machine separates loose ICs into front and back sides using a flexible vibrating plate and a vision camera. Then, a suction nozzle picks up the separated ICs and places them at the camera position for orientation and mixing identification. Defective ICs are discarded in a defective box, while OK ICs are placed sequentially into the taping system and re-identified by a rear-end orientation recognition camera. After identification, the encapsulation film is pressed onto the ICs, completing the taping and packaging process.

1. High Efficiency: Maximum capacity 6K/H
2. Precision: Precise vision gripping, defective products discarded
3. Compatibility: Suitable for chips, metal parts, plastic parts, TF cards, irregularly shaped parts, etc., with dimensions of 2~30mm
4. Operation: Quick product switching, easy to learn.

The automatic flexible taping machine separates loose ICs into front and back sides using a flexible vibrating plate and a vision camera. Then, a suction nozzle picks up the separated ICs and places them at the camera position for orientation and to identify whether they are mixed. Defective ICs are discarded in a defective box, while OK ICs are placed sequentially into standard trays. After tray loading, the machine automatically stacks and loads trays for the next batch.

1. High Efficiency: Maximum capacity 6K/H
2. Precision: Precise vision-based picking, defective ICs discarded
3. Compatibility: Suitable for chips, hardware, plastic parts, TF cards, and irregularly shaped parts with dimensions of 2~30mm
4. Operation: Quick product switching, easy to learn, automatic tray loading and unloading